Showing 8351-8360 of 11714 products
CHIP QUIK
Precise no-clean lead-free solder paste syringe (5cc) for PCB assembly, with clear residue and wide process window.
No-clean lead-free solder paste in syringe form. Fast printing, low voiding & clear residue. Ideal for electronics assembly.
Premium no-clean lead-free solder paste (Sn96.5/Ag3/Cu0.5) for PCB assembly. 250g jar, T3 mesh, 220°C melting point.
High-quality no-clean lead-free solder paste (Sn96.5/Ag3/Cu0.5) in 50g jar. Ideal for PCB assembly and precision soldering.
No-clean, low-temp solder paste (138°C) for PCBs. Lead-free, 10cc syringe with plunger & tip. Refrigerated shelf life: 6+ months.
CHIP QUIK low-temp solder paste (138°C) for delicate electronics. No-clean, lead-free, 50g jar. Ideal for PCB assembly.
CHIP QUIK's lead-free solder paste (138°C) for delicate electronics. No-clean, syringe-applied with precision tip.
Low temp lead-free solder paste (138°C), 50g jar. Ideal for delicate components & PCB assembly. No-clean residue.
High-quality lead-free solder paste in syringe for precise applications. Sn96/Ag3/Cu0.5 alloy with 220°C melting point.
CHIP QUIK lead-free, no-clean solder paste with T4 mesh. Thermally stable, 50g jar for reliable soldering.