Bergquist Gap Pad Vo Soft Thermal Interface Sheet 100 mm x 100 mm

Bergquist Gap Pad Vo Soft Thermal Interface Sheet is a soft, pliable thermal gap pad that bridges the thermal interface between heat sinks and sensitive electronic components. Supplied as a 100 mm x 100 mm sheet, it fills uneven surfaces, microscopic air gaps and rough textures to support efficient heat transfer.

Overview

The Bergquist Gap Pad Vo Soft addresses common thermal challenges such as uneven surface topography, microscopic air gaps and rough surface textures that can impede heat dissipation. By filling these voids, it reduces thermal resistance and helps direct heat away from critical devices. Its highly conformable nature allows it to mould to surface imperfections, minimising interfacial resistance and creating a uniform thermal pathway.

Key Features

• Eliminates air gaps by compressing to fill voids, lowering thermal resistance
• Highly conformable, adapting to uneven surfaces and rough textures
• Low-stress vibration dampening with a cushioning effect for delicate components
• Formulated for compatibility with automated dispensing equipment
• Ready-to-use 100 mm x 100 mm sheet that can be cut and shaped to suit specific requirements
• Thermal conductivity of 0.8 W/m.K

Applications

Designed for low-stress applications, this soft sheet suits fragile components that could be damaged by more rigid or high-pressure thermal pads. It is a suitable choice for managing heat in power supplies, LED assemblies, computing hardware and automotive ECUs.

Specifications

• Sheet Size: 100 mm x 100 mm
• Thermal Conductivity: 0.8 W/m.K
• Width: 3.3
• Depth: 1.5
• Height: 4.3
• Weight: 56 gm

Choose the Bergquist Gap Pad Vo Soft when a soft, conformable thermal interface sheet is needed to improve heat transfer between heat sinks and sensitive electronics.