Multicomp Pro Heatsink for SOT-23, TO-126, TO-220, 13.6°C/W

The Multicomp Pro MC33260 is a 30mm extruded aluminium heatsink designed to efficiently dissipate heat in various electronic applications. Featuring a slotted mounting hole, this heatsink allows for straightforward and secure installation onto compatible circuit boards or enclosures. Effective thermal management is critical in preventing component failure, and this extruded design maximises surface area for optimal heat dissipation.

With a thermal resistance of 13.6°C/W, it provides effective cooling for a range of transistor packages, specifically SOT-23, TO-126, and TO-220. This versatile component supports both vertical and horizontal mounting orientations, offering flexibility during the design and assembly process to suit specific spatial requirements within your project.

Key Features and Specifications

• Material: High-quality extruded aluminium
• Thermal Resistance: 13.6°C/W
• Compatible Packages: SOT-23, TO-126, TO-220
• Mounting Style: Vertical or horizontal mount
• Mounting Hole: Slotted
• Dimensions: 43mm (H) x 33mm (W) x 15mm (D)
• Weight: 2g

Suitable for integration into HVAC systems and other thermal management scenarios, this Multicomp Pro heatsink ensures reliable performance and longevity for your semiconductor components by maintaining optimal operating temperatures.