OXLEY PCB Surface Mount Ball & Socket Test Point, Gold Plated

The OXLEY PCB Surface Mount Ball and Socket Test Point is a unique test terminal designed to provide accurate line tests during PCB assembly. Engineered for precision, this surface mount device (SMD) ensures reliable connectivity when testing circuit boards, making it an essential component for electronics manufacturing and quality assurance environments.

A standout feature of this test point is its unique retention mechanism, which enhances overall reliability by maintaining a low-stress contact. This design minimises the risk of damage to the PCB or the test point itself during repeated testing cycles. Additionally, the component offers low contact resistance, ensuring precise and consistent measurement results every time.

For added convenience during the manufacturing process, these test points can be supplied loose or on tape and reel, facilitating automated assembly and improving production efficiency. The contacts are constructed from a high-quality copper alloy and feature a gold plating, which improves conductivity while providing excellent resistance to oxidation and wear, ensuring long-lasting performance.

Key Features and Specifications

• Surface mount design for straightforward PCB integration
• Unique retention mechanism for low-stress contact and enhanced reliability
• Low contact resistance for accurate testing
• Gold-plated copper alloy contacts for superior conductivity and durability
• Supplied loose or on tape and reel for assembly flexibility
• Compact dimensions: 43 mm (Height) x 33 mm (Width) x 15 mm (Depth)
• Lightweight design at just 1.361 grams

Whether you are setting up a new production line or require dependable test points for rigorous quality checks, the OXLEY surface mount test terminal delivers the performance and reliability required for demanding electronic applications.