TUK 3 Way LSA+ IDC Contact PCB Header, 5.08mm Pitch, Pack of 20

The TUK 3 Way LSA+ IDC Contact PCB Header provides a fast, reliable, and solder-free connection for wire-to-board applications. Utilising LSA+ insulation displacement contact (IDC) technology, it allows for quick termination using a standard punch-down tool, eliminating the need for time-consuming soldering or screw terminations. This streamlined process ensures consistent, gas-tight connections every time, speeding up assembly and reducing labour costs.

Designed for secure mounting, this header includes PCB mount retaining posts suitable for heat staking, which ensures a robust and vibration-resistant fit on the circuit board. The compact, single-row design with a 5.08mm pitch between contacts makes it ideal for applications where space is at a premium. It is fully compatible with wave soldering processes, facilitating efficient, high-volume production.

Constructed for durability and reliable electrical performance, the contacts are made from phosphor bronze and feature a silver plating. This combination offers excellent conductivity and corrosion resistance. With a voltage rating of 60V AC RMS and an operating temperature range from -20°C to 125°C, this header is suited for a wide variety of industrial, telecommunications, and control panel environments where stable connections are critical.

Supplied in a convenient pack of 20, this component is an essential part of the B238 series, also known under the BT code 238A. It is a versatile and cost-effective solution for creating permanent wire-to-board interfaces in electronic assemblies.