Chip Quik No Clean Solder Paste Sn96.5/Ag3.0/Cu0.5, 2-Part Mix, 15g (T4)
Lead-free no-clean solder paste (Sn96.5/Ag3.0/Cu0.5) ideal for SMT, BGA & fine-pitch soldering.
The Chip Quik No Clean Solder Paste Sn96.5/Ag3.0/Cu0.5 is a high-performance, lead-free soldering solution, ideal for precision electronics assembly and repair. This two-part mix ensures ease of application while maintaining excellent soldering performance. It features a synthetic no-clean flux with an REL0 classification, meaning it leaves minimal residue, eliminating the need for post-soldering cleaning. The paste has a high metal content of 87%, ensuring strong and reliable solder joints.
The T4 particle size (20-38 microns) makes it particularly suitable for fine-pitch and surface-mount applications, providing superior adhesion and flow characteristics. It has a melting temperature of 217°C, making it compatible with a wide range of soldering processes, from hand-soldering to reflow and hot-air techniques.
Key Applications
- Surface-mount technology (SMT)
- Fine-pitch component soldering
- Rework and repair of PCBs
- BGA and QFN soldering
- High-reliability electronic assemblies
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- Dispatched within 0-2 business days
- Delivery to United States: 3-5 business days*
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- Surface-mount technology (SMT)
- Fine-pitch component soldering
- Repair and rework of PCBs
- BGA and QFN soldering
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- Flux Type: No-Clean
- Flux Classification: REL0
- Metal Content: 87% by weight
- Particle Size: T4 (20-38 microns)
- Solder Alloy: Sn96.5/Ag3.0/Cu0.5
- Melting Temperature: 217°C
- Weight: 15g
- Packaging: 2-Part Mix
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