Proto-Advantage adaptor converts 0.5mm pitch VSSOP-8 ICs to DIP-8. Gold-plated pins, FR-4 PCB. Ideal for prototyping.
Convert 8-VSOP to 8-DIP with this 0.65mm pitch SMT adaptor from Proto-Advantage. Supplied unassembled with pins included. Soldering required.
Proto-Advantage SMT adaptor converts 6-SOT23 (0.95mm) to 6-DIP. Gold-plated pins, FR-4 PCB. Ideal for prototyping & testing.
Proto-Advantage SMT adaptor converts SOT23-5 to DIP-6. Gold-plated pins on FR-4 PCB for precise prototyping & testing.
Proto-Advantage SC70-6 to DIP-6 SMT adaptor, 0.65 mm pitch to 2.54 mm DIP footprint. Gold-plated pins for prototyping and circuit testing.
Proto-Advantage unassembled adaptor converts 6-pin TSOC SMD to DIP. 1.27mm pitch, includes pins. Ideal for prototyping.
Proto-Advantage SMT adaptor converting 20-PLCC/LCC/JLCC to 20-DIP. 1.27mm pitch. Unassembled with pins included.
Proto-Advantage unassembled adaptor converts 5-lead SOT-223 to 8-pin DIP for prototyping, testing & repair. 1.5mm pitch.
Convert TO-263-3 (DDPAK/D2PAK) to DIP-6 format with this 2.54mm pitch SMT adaptor. Unassembled with pins included.
Proto-Advantage unassembled adaptor converts 48-lead TSOP to DIP. 0.5mm pitch, 43x33x15mm. Ideal for prototyping & PCB repair.
SOIC/SOP to DIP SMT adaptor, FR-4 UL94V-0, 20.32x35.56mm, accepts 4-28 pin packages, fits breadboards.
Convert 0402-1210 SMDs to 6-SIP with this unassembled Proto-Advantage adaptor. FR-4 PCB, right angle header included.
Proto-Advantage adaptor converts SOT-23 & SMD components to a 6-pin SIP header. FR-4 PCB, 2.54mm pitch, ideal for high-density prototyping.
Precision stainless steel stencil for 0.5mm pitch, 30-pin FPC/FFC SMT connectors. Essential for accurate solder paste application in electronics assembly.
Precision stainless steel solder stencil for QFN-16 packages (0.65mm pitch, 4x4mm). Ideal for SMT assembly and PCB prototyping.
Stainless steel MSOP-16 solder stencil by Proto-Advantage. 0.5mm pitch, 4x3mm body. Ideal for precise SMT paste application.
Precision stainless steel stencil for SOIC-8 packages (1.27mm pitch). Ideal for SMT PCB assembly, prototyping & soldering. Durable & laser-cut.
Proto-Advantage stainless steel stencil for SOIC-16 packages with 1.27mm pitch. Ensures precise solder paste application.
Precision stainless steel solder stencil for SOIC-28 packages (1.27mm pitch). Ideal for PCB prototyping and SMT assembly.
Precision stainless steel solder paste stencil for TSSOP-20 IC packages (0.65mm pitch). Ideal for PCB prototyping and assembly.
Proto-Advantage TSSOP-24 stainless steel solder stencil with 0.65mm pitch. Ideal for precise solder paste application. Dimensions: 43x33x15mm.
Proto-Advantage stainless steel stencil for TSSOP-28 packages with 0.65mm pitch. Ensures accurate solder paste application.
Precision stainless steel stencil for QFN-32 packages with 0.5mm pitch. Durable and reliable for SMT assembly.
