Low-temperature, lead-free solder paste (138°C) in 5cc syringe. No-clean flux, Sn42/Bi57.6/Ag0.4 alloy. Ideal for PCBs.
The CHIP QUIK Lead-Free Low-Temperature Solder Paste in a 5cc syringe applicator offers precise dispensing for delicate PCB (Printed Circuit Board) assembly and repair work. This no-clean, lead-free solder paste features a low melting point (138°C), reducing the risk of thermal damage to sensitive electronic components. Its formulation ensures excellent wetting compatibility on most board finishes, minimising voids for reliable solder joints.
Key Features
Specifications
Ideal for rework, SMD assembly, and prototyping, this solder paste provides superior performance while maintaining component safety.
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
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