Chip Quik No Clean Solder Paste Sn42/Bi57.6/Ag0.4, 15g, T4
Lead-free no-clean solder paste with 87% metal content. Ideal for PCB assembly and SMD work. 138°C melting point.
The Chip Quik No Clean Solder Paste Sn42/Bi57.6/Ag0.4 is a high-performance solder paste designed for lead-free applications. Featuring a no-clean synthetic flux, it ensures minimal residue and eliminates the need for post-soldering cleaning, making it ideal for precision electronics work.
This two-part mix offers excellent stability with a shelf life of 2 years unrefrigerated before mixing. Once mixed, it maintains reliability for over 6 months when refrigerated or 2 months unrefrigerated.
Key Features:
- Flux Type: Synthetic No-Clean (REL0 classification)
- Metal Content: 87% by weight
- Particle Size: T4 (20-38 microns)
- Solder Alloy: 42% Tin (Sn), 57.6% Bismuth (Bi), 0.4% Silver (Ag)
- Melting Temperature: 138°C
With its fine particle size and reliable flux performance, this solder paste ensures clean and strong joints, making it perfect for PCB assembly and rework.
- PCB assembly
- Surface-mount (SMD) soldering
- Rework and repair applications
- Precision electronics soldering
- No-Clean and Lead-Free
- Flux Type: Synthetic No-Clean
- Flux Classification: REL0
- Metal Content: 87% by weight
- Particle Size: T4 (20-38 microns)
- Two-part mix
- Melting Temperature: 138°C
- Weight: 40g (net), 15g solder paste
- Shelf Life: 2 years unrefrigerated (before mixing), >6 months refrigerated / >2 months unrefrigerated (after mixing)
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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