Multicomp Lead Free Solder Wire, 0.7mm, 250g, Tin-Copper Alloy
Multicomp lead-free solder wire (0.7mm, 250g) with no-clean flux. Ideal for PCBs, repairs & high-temperature alloys.
The Multicomp Lead Free Solder Wire is a high-quality, halide-activated flux-cored solder wire specially designed for no-clean wave and reflow soldering processes. Formulated with 99.3% tin and 0.7% copper, this solder wire ensures reliable, fast soldering on copper, brass, and solder-coated surfaces. Its mildly activated no-clean flux minimises fuming and spitting while leaving minimal residues that do not require post-soldering cleaning.
Key Features
- No-Clean Flux (Type 505): Optimised for lead-free assembly, eliminating the need for additional cleaning.
- High Thermal Stability: Suitable for high-melting-temperature alloy applications, including nickel surfaces (depending on oxidation state).
- Low Residues: Clear, non-corrosive residues facilitate hassle-free PCB assembly and rework.
- Legislative Compliance: Meets all lead-free regulatory standards, making it ideal for modern electronics manufacturing.
- Versatile Applications: Effective for general lead-free soldering, PCB repairs, and rework in no-clean processes.
With a fine 0.7mm diameter and a melting point of 227°C, this solder wire provides precision and efficiency for detailed electronic work. The 250g spool offers ample material for professional or hobbyist use.
- Lead-free PCB assembly
- Reflow/wave soldering
- Post-clean solder repairs
- Copper/brass surface soldering
- Material Composition: 99.3% Tin, 0.7% Copper
- Flux Type: No Clean, Rosin (Halide-Activated, Low Activation)
- Diameter: 0.7mm
- Melting Temperature: 227°C
- Weight: 250g
- Flux Content: 3% by Weight
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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