Multicomp Lead-Free Solder Wire, 0.9mm, 250g, Sn99.3/Cu0.7
High-quality lead-free solder wire with rosin flux core. Fast wetting, no-clean residue, ideal for electronics.
The Multicomp Lead-Free Solder Wire provides high-quality performance for general-purpose electronic assembly and rework applications. With a composition of 99.3% tin and 0.7% copper, it complies with all lead-free legislative requirements.
This solder wire contains multiple cores of rosin-based, halide-activated flux, ensuring fast and reliable soldering on copper, brass, and solder-coated surfaces. Its no-clean, pale-coloured residue eliminates the need for post-soldering cleaning, making it ideal for wave and reflow soldering processes, as well as repair operations.
Key Features:
- Contains rosin-based flux for enhanced wetting
- No-clean residue minimises post-soldering work
- Fast wetting for efficient soldering
- Halide-activated for better performance on nickel surfaces (depending on oxidation)
- Complies with lead-free regulations
Technical specifications:
- Alloy Composition: Sn99.3/Cu0.7 (99.3% Tin, 0.7% Copper)
- Flux Type: No Clean / Rosin Flux, halide-activated
- Diameter: 0.9mm
- Melting Temperature: 227°C
- Weight: 250g
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- Shipped within 0-2 business days
- Shipping to United States: 3-5 business days*
- Free Shipping Included
- General electronic assembly and repair
- Wave and reflow soldering
- Copper and brass soldering
- Solder-coated surfaces
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- Alloy Composition: 99.3% Tin, 0.7% Copper
- Flux Type: No Clean & Rosin Flux
- Flux Activation: Halide, normal activation
- Diameter: 0.9mm
- Melting Temperature: 227°C
- Weight: 250g
Always follow local regulations and product guidance.
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
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