Multicomp Lead-Free Solder Wire, 1mm, 217°C, 250g
Multicomp lead-free solder wire (1mm) with mildly activated flux, 217°C melting point. Ideal for electronics & DIY.
The Multicomp Lead-Free Solder Wire is a high-quality, halide-free solder wire designed for superior soldering performance. Made from a lead-free alloy (97.1% tin, 2.6% silver, 0.3% copper), this solder wire ensures a robust and reliable connection while complying with international standards.
This product features a mildly activated no-clean flux, which minimises residue and reduces post-soldering cleanup. The halide-free formulation (Type 400) makes it an excellent choice for applications requiring minimal residue and low environmental impact. Additionally, the flux content is optimised to enhance soldering speed and spread, particularly on materials like copper, brass, and nickel.
Key benefits include:
- Clear residues for minimal post-soldering cleanup
- Low spitting for clean, precise soldering
- Fast, efficient soldering across a range of applications
- Mild odour, ensuring a more pleasant working environment
With a melting temperature of 217°C and an external diameter of 1mm, this 250g spool is ideal for electronics, DIY, and professional use.
- Shipped within 0-2 business days
- Shipping to United States: 3-5 business days*
- Free Shipping Included
- Electronics assembly
- PCB repairs
- DIY soldering projects
- Professional electrical work
- Material Composition: 97.1% Tin, 2.6% Silver, 0.3% Copper
- Flux Type: No Clean and Rosin Flux
- Flux Activation Level: Low
- External Diameter: 1mm
- Melting Temperature: 217°C
- Weight: 250g
- Halide Content: Free (Type 400)
- Residue Appearance: Clear, low residue
- Solder Alloy: SnAgCu (97.1/2.6/0.3)
Always follow local regulations and product guidance.
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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