Multicomp No-Clean Lead-Free Solder Wire, 0.7mm, 250g
High-activity lead-free solder wire (0.7mm), 250g, with no-clean rosin flux for electronics and PCB soldering tasks.
The Multicomp No-Clean Lead-Free Solder Wire is specially formulated to complement no-clean wave and reflow soldering processes, making it an ideal choice for both professional and hobbyist applications. Its high-activity flux ensures fast soldering with excellent spread on copper, brass, and nickel surfaces.
This solder wire features a halide-free formulation, making it suitable for users who require environmentally friendly materials. The resin-based flux ensures reliable performance with minimal odour and low spitting, providing a clean and efficient soldering experience.
Key Features:
- Material Composition: 97.1% Tin, 2.6% Silver, 0.3% Copper
- Flux Type: No-Clean Rosin, Halide Activated (Normal Activation Level)
- Diameter: 0.7mm
- Melting Temperature: 217°C
- Weight: 250g
- Lead-Free: Fully compliant with environmental and safety standards
- Low Spitting: Ensures cleaner soldering with minimal waste
- Fast Flowing: Provides quick and reliable connections
Multicomp’s Type 511 Solder Wire is perfect for precision electronics work, PCB assembly, and general soldering tasks where lead-free materials are required.
Need larger quantities? Need additional quantities? Get in touch and we'll arrange it for you.
- Shipped within 0-2 business days
- Shipping to United States: 3-5 business days*
- Free Shipping Included
- No-clean wave soldering
- Reflow soldering
- PCB assembly
- Electronics repair
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- Material Composition: 97.1% Tin, 2.6% Silver, 0.3% Copper
- Flux Type: No Clean / Rosin (Halide Activated)
- Solder Alloy: Sn97.1Ag2.6Cu0.3
- Diameter: 0.7mm
- Melting Temperature: 217°C
- Weight: 250g
- Lead-Free: Yes
- Special Feature: Halide-Free Formulation
- Special Feature: Good Spread on Copper, Brass & Nickel
- Special Feature: Low Spitting (Heat Stable)
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