MULTICOMP No-Clean Lead-Free Solder Wire, 1mm, 500g
MULTICOMP lead-free solder wire with no-clean flux, 1mm diameter & 217°C melting point. Ideal for electronics & PCB work.
The MULTICOMP Solder Wire is a lead-free, mildly activated no-clean flux solder designed for superior performance in various soldering applications. Made from a precise alloy composition of 97.1% Tin, 2.6% Silver, and 0.3% Copper, it ensures strong, reliable joints with minimal residue.
This solder wire features a halide-free formulation (Type 400), making it an excellent choice for those requiring reduced residue appearance and minimal odour. The resin-based, low-activation flux provides fast soldering with excellent spread on materials like copper, brass, and nickel, ensuring clean and efficient connections.
Key Features
- Halide-free, mildly activated no-clean flux (Type 400) for reduced residue
- Fast soldering with good thermal stability and low spitting
- Clear residues, ensuring a clean finish
- Suitable for lead-free soldering applications
- Conforms to national and international standards
With a melting temperature of 217°C and an external diameter of 1mm, this solder wire is ideal for precise and controlled applications. The 500g spool offers ample material for extended use.
- Shipped within 0-2 business days
- Shipping to United States: 3-5 business days*
- Free Shipping Included
- Electronics assembly
- Circuit board soldering
- Copper, brass, and nickel joints
- Precision soldering applications
- Material Composition: 97.1% Tin, 2.6% Silver, 0.3% Copper
- Flux Type: No-Clean Rosin Flux
- Flux Activity: Mildly Activated (Halide-Free in Type 400)
- Lead-Free: Yes
- External Diameter: 1mm
- Melting Temperature: 217°C
- Weight: 500g
Always follow local regulations and product guidance.
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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