AMEC THERMASOL Ceramic Heatsink 10x10x2mm with Tape

The AMEC THERMASOL MPC101020T is a low-profile, lightweight, flat Micro-Porous Ceramic Heat Sink (MPCHS) designed for advanced thermal management. Measuring 10x10x2mm, its highly micro-porous structure provides an exceptionally large surface area compared to traditional copper or aluminium heatsinks. This unique design enables superior heat dissipation directly away from components, without storing heat within the material itself, ensuring more efficient cooling.

This ceramic heatsink boasts the lowest thermal capacity per unit volume when compared to standard metal alternatives, allowing it to respond quickly to temperature changes. It is supplied ready to install with a pre-applied layer of thermally conductive silicone adhesive tape, simplifying the assembly process.

A key advantage is its non-electrically conductive property, which eliminates risks of short circuits and prevents any antenna effect that could interfere with sensitive electronic signals. Its compact, low-profile form factor is ideal for applications where space and weight are at a premium.

Key Features & Benefits

• Micro-Porous Ceramic Construction: Offers a vastly larger surface area for heat dissipation than solid metal heatsinks.
• Low Thermal Capacity: Does not store heat, facilitating faster and more efficient cooling.
• Electrically Insulating: Safe for use on live components without risk of short circuits.
• Integrated Adhesive: Includes thermally conductive silicone tape for easy, secure mounting.
• Lightweight and Low-Profile: Perfect for densely packed electronic assemblies and portable devices.

Primary Applications

This heatsink is specifically engineered for use in consumer electronics, where efficient thermal management is critical for performance and longevity. It is ideal for cooling processors, power regulators, LEDs, and other heat-generating ICs​