
High-conformability BERGQUIST thermal pad. 2.7W/m·K conductivity, 100x100mm sheet for heat sinks & electronics.
The BERGQUIST Gap Pad 2500 is a high-performance, non-reinforced thermal interface material designed to efficiently manage heat transfer between components. It excels in applications where air gaps, uneven surfaces, or rough textures are present, providing an effective thermal bridge between heat sinks and electronic devices. Its inherent tackiness and high conformability ensure excellent surface contact, eliminating air pockets that cause thermal resistance. This results in significantly improved thermal performance and reliability for sensitive electronic assemblies.
This versatile pad is engineered for demanding environments, offering low-stress vibration dampening to protect components from mechanical shock. It is compatible with automated dispensing equipment, facilitating high-volume, precision application in manufacturing processes. Supplied as a convenient 100mm x 100mm sheet, it is easy to handle and cut to size for specific project requirements.
Key Features & Benefits
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