Ceramic Heat Sink 20x20x2.5mm with Thermal Tape

The AMEC THERMASOL MPC202025T is a compact, low-profile ceramic heat sink measuring 20 x 20 x 2.5 mm. Its innovative micro-porous structure creates an exceptionally large surface area compared to conventional copper or aluminium heat sinks, enabling excellent heat dissipation without storing heat within the component itself. This design also delivers one of the lowest thermal capacities per unit volume among common heat sink materials.

Supplied with a thermally conductive silicone adhesive tape for simple, secure mounting, the heat sink is non-electrically conductive and exhibits no antennae effect, making it ideal for sensitive electronic applications. Its light weight and slim profile allow for versatile integration into space-constrained devices.

Key Features:

• Low profile and light weight
• Large surface area compared to aluminium heat sinks
• Non-electrically conductive, no antennae effect
• Thermally conductive silicone adhesive tape included
• Thermal resistance: 10.21°C/W

Whether used in consumer electronics or specialised thermal management systems, this ceramic heat sink offers reliable and efficient cooling in a compact form factor.