CHIP QUIK Lead-Free Solder Paste, No-Clean, T4 Mesh, 50g
CHIP QUIK lead-free, no-clean solder paste with T4 mesh. Thermally stable, 50g jar for reliable soldering.
The CHIP QUIK No-Clean Lead-Free Solder Paste offers superior performance with a thermally stable formula, ideal for precision soldering applications. This 50g jar ensures long stencil life and a wide process window, making it perfect for both hobbyists and professionals.
This solder paste provides excellent wetting compatibility with most board finishes, ensuring reliable solder joints. Its low voiding and clear residue properties make it a clean and efficient choice for high-quality soldering work. The paste is dispense grade and compatible with enclosed print heads for smooth application.
Key Benefits
- No-clean formulation for hassle-free use.
- Thermally stable for consistent results.
- Excellent wetting compatibility with most board finishes.
- Clear residue and low voiding for high-quality solder joints.
- Long stencil life and wide process window for efficiency.
Specifications
- Alloy: Sn96/Ag3/Cu0.5
- Flux Type: Synthetic No Clean
- Solder Alloy: 96.5% Sn, 3% Ag, 0.5% Cu
- Melting Temperature: 220°C
- Weight: 50g
- Mesh Size: T4
Perfect for use in electronics assembly, prototyping, and repair, this solder paste ensures high performance and reliability for all your soldering needs.
- Electronics assembly
- Prototyping
- PCB repair and rework
- SMT (Surface Mount Technology) applications
- Alloy: Sn96/Ag3/Cu0.5
- Flux Type: Synthetic No Clean
- Solder Alloy: 96.5% Sn, 3% Ag, 0.5% Cu
- Melting Temperature: 220°C
- Weight: 50g
- Mesh Size: T4
- Printing Speed: Up to 125mm/sec
- Dispense Grade: Yes
- Compatible with Enclosed Print Heads
- Thermally Stable
Always follow local regulations and product guidance.
Free standard delivery on UK mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For faulty items, contact us within 14 days for a replacement or refund.
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