CHIP QUIK Lead-Free Solder Paste Syringe, 15g, Sn96/Ag3/Cu0.5
High-quality lead-free solder paste in syringe for precise applications. Sn96/Ag3/Cu0.5 alloy with 220°C melting point.
The CHIP QUIK Lead-Free Solder Paste Syringe is a high-performance, no-clean solder paste solution designed for precision applications. This thermally stable solder paste comes in a convenient syringe applicator with a plunger and tip, making it ideal for both manual and automated dispensing processes.
Key Features
- Lead-free composition: Environmentally friendly with alloy composition Sn96/Ag3/Cu0.5
- High-speed printing: Capable of printing speeds up to 125mm/sec
- Long stencil life: Reduces the need for frequent stencil cleaning
- Wide process window: Provides flexibility in various soldering conditions
- Low voiding: Ensures reliable electrical connections
- Excellent wetting compatibility: Works well with most board finishes
- Clear residue: Leaves minimal post-soldering residue
- Dispense grade: Suitable for precise application
Technical Specifications
- Alloy: Sn96/Ag3/Cu0.5
- Flux Type: Synthetic No Clean
- Solder Composition: 96.5% Sn, 3% Ag, 0.5% Cu
- Melting Temperature: 220°C
- Weight: 15g
This solder paste is perfect for professional electronics assembly and repair work, offering reliable performance and consistent results.
- Electronics assembly
- PCB rework and repair
- Surface mount technology (SMT)
- Automated soldering processes
- Alloy: Sn96/Ag3/Cu0.5
- Flux Type: Synthetic No Clean
- Solder Composition: 96.5% Sn, 3% Ag, 0.5% Cu
- Melting Temperature: 220°C
- Weight: 15g
- Package Weight: 30g
- Printing Speed: Up to 125mm/sec
- Stencil Life: Long
- Process Window: Wide
- Residue: Clear
- Voiding: Low
- Compatibility: Excellent wetting on most board finishes
- Grade: Dispense
- Mesh: T4
Free standard delivery on UK mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For faulty items, contact us within 14 days for a replacement or refund.
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