CHIP QUIK No-Clean Lead-Free Low-Temp Solder Paste, 50g

The CHIP QUIK No-Clean Lead-Free Low Temperature Solder Paste is an advanced, user-friendly solution for delicate soldering tasks. This solder paste comes in a convenient 50g jar, making it perfect for both professional and hobbyist applications.

Its low melting point of 138°C ensures reduced thermal damage to sensitive components, allowing for lower heat settings during application. The paste offers excellent performance with printing speeds of up to 100mm/sec and provides a long stencil life, enhancing productivity.

Key Benefits:

• No-clean formulation leaves clear residues, minimising post-soldering cleanup.
• Excellent wetting compatibility with most board finishes ensures reliable solder joints.
• Low voiding results in strong, durable connections.
• Wide process window for versatile application.
• Shelf life: Over 6 months when refrigerated, and more than 2 months at room temperature.

Compatibility:

• Suitable for dispensing applications.
• Works seamlessly with enclosed print heads.

Ideal for: Precision soldering in electronics, PCB assembly, and rework where thermal sensitivity is a concern.