Convenient no-clean, lead-free solder paste in syringe for precision PCB assembly and repair. Sn96.5/Ag3/Cu0.5 alloy, 217°C melting point.
The CHIP QUIK No-Clean Lead-Free Solder Paste Syringe offers a convenient and efficient solution for precision soldering applications. This solder paste comes in a ready-to-use syringe applicator, complete with a plunger and tip for easy dispensing. The no-clean formula ensures minimal residue, making it ideal for applications where post-soldering cleaning is not desired.
Key Features
Technical Specifications
This solder paste is perfect for both professional and hobbyist applications, offering reliability and ease of use in electronic assembly and repair.
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