ELECTROLUBE HTSP Silicone Heat Transfer Compound Plus, 50ml Tube

The ELECTROLUBE HTSP Silicone Heat Transfer Compound Plus is a premium thermal interface paste supplied in a convenient 50ml tube. This high-performance compound is engineered to efficiently dissipate large amounts of heat from electronic components, ensuring reliable thermal management and optimal device performance.

Formulated as a non-curing paste, HTSP maintains a stable, grease-like consistency over time. This unique property allows for simple and efficient rework of components if required, without the risk of hardening that can make removal difficult. Its very low viscosity ensures effortless application, spreading smoothly to create a thin, effective thermal bond between surfaces.

Key Features & Benefits

• High Thermal Conductivity: Facilitates the optimum transfer of heat away from sensitive components, preventing overheating and extending operational life.
• Exceptional Temperature Range: Based on a silicone oil formulation, it offers an exceptionally wide operating temperature range from -50°C to +200°C, making it suitable for demanding environments.
• Non-Curing Silicone Paste: Remains pliable indefinitely, allowing for easy maintenance and component replacement.
• Excellent Dielectric Strength: With a dielectric strength of 18KV/mm, it provides good electrical insulation properties, reducing the risk of short circuits.
• Effective Formulation: Contains powdered metal oxides as the primary thermo-conductive component within a silicone oil base, resulting in its characteristic pale grey colour.

Technical Specifications

• Dispensing Method: Easy-to-use tube for precise application.
• Volume: 50ml.
• Density: 3g/ml at 20°C.
• Viscosity: 42 to 48Pas at 1rpm.
• Product Range: Part of the trusted ELECTROLUBE HTSP Series.

Ideal for engineers and technicians, this heat sink compoundis