
Compact aluminium heatsink for SMD packages. Thermal resistance 63°C/W, low profile, effective heat transfer.
The Fischer Elektronik SMD Heatsink is specifically engineered for use with surface-mount device (SMD) packages, offering an efficient and compact thermal management solution. With a low profile and reduced weight, this heatsink is ideal for space-constrained applications where effective heat dissipation is critical. It delivers effective heat transmission by bonding directly onto the IC package, ensuring reliable cooling for your components.
This aluminium heatsink provides a thermal resistance of 63°C/W, making it suitable for a range of SMD package types, including SOIC-20, SOIC-24, SSOP-48, TSSOP-48, TSSOP-56, and TSSOP-64. The construction material, aluminium, ensures both lightweight and durable performance.
Key Features
Product Dimensions
The heatsink is supplied without any external finish, allowing for direct application. Note: This product contains no Substances of Very High Concern (SVHC) as of 17-Jan-2023, ensuring compliance with current regulations.
Whether you are prototyping or in full production, this heatsink from Fischer Elektronik provides a reliable and effective cooling solution for your SMD components, helping to maintain optimal operating temperatures and enhance overall system reliability.
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