Multicomp Lead-Free Solder Wire, 0.7mm, 217°C, Mildly Activated, 500g
High-quality Multicomp lead-free solder wire, 0.7mm dia, 217°C melt point. Mildly activated no-clean flux. Ideal for precision electronics.
The Multicomp Lead-Free Solder Wire is engineered for precision soldering with a lead-free alloy formulation that prioritises performance and safety. Made from 97.1% tin, 2.6% silver, and 0.3% copper, this solder wire complies with national and international lead-free standards, ensuring reliability across various electronic applications.
Key Features
- Mildly Activated No-Clean Flux – Leaves minimal residue, reducing post-soldering cleanup.
- Halide-Free (Type 400) – Ideal for applications requiring reduced chemical residue.
- Fast Soldering Performance – Ensures efficient heat transfer and strong joint formation.
- Clear Residues & Good Spread – Works effectively on copper, brass, and nickel surfaces.
- Low Spitting & Stable Heating – Minimises splatter for cleaner work areas.
This solder wire is available with different flux content options (e.g., 2.2% or 3%) to balance performance and residue reduction, making it suitable for professional and hobbyist use alike.
Specifications
- Alloy Composition: 97.1% Sn, 2.6% Ag, 0.3% Cu
- Flux Type: No Clean, Mildly Activated
- Diameter: 0.7mm
- Melting Temperature: 217°C
- Weight: 500g
Ideal for PCB assembly, electronics repair, and other precision soldering tasks, this Multicomp solder wire ensures high-quality, reliable connections with minimal post-soldering residue.
- PCB assembly
- Electronics repair
- Circuit board soldering
- Jewellery making
- Material Composition: 97.1% Tin, 2.6% Silver, 0.3% Copper
- Flux Type: No Clean, Rosin Flux, Mildly Activated
- Diameter: 0.7mm
- Melting Temperature: 217°C
- Weight: 500g
Free standard delivery on UK mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For faulty items, contact us within 14 days for a replacement or refund.
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