QUALITEK No-Clean Solder Paste Sn63/Pb37, 10cc Syringe, 183°C Melt

The QUALITEK DSP 619D No-Clean Solder Paste is a high-performance solution designed for surface mount applications, delivered in a convenient 10cc syringe for precision dispensing. This solder paste ensures excellent wettability, making it ideal for electronic assembly tasks requiring reliability and ease of use.

The paste leaves behind a transparent, soft, and non-conductive residue, which is pin-testable post-soldering, eliminating the need for cleaning in most applications. Its no-clean formulation saves time and effort in the production process while maintaining high-quality solder joints.

Key Benefits

• Efficient Dispensing: The 10cc syringe with plunger allows for accurate and controlled application, reducing waste and improving work precision.
• Superior Performance: Excellent wettability ensures reliable solder joints with minimal defects.
• No-Clean Residue: The transparent residue is non-conductive and pin-testable post-solder, ideal for applications where cleaning is unnecessary or impractical.
• Safe Handling: Should be stored in a sealed container and disposed of in compliance with local regulations.

Specifications

• Flux Type: No Clean
• Solder Alloy Composition: 63% Tin (Sn), 37% Lead (Pb)
• Melting Temperature: 183°C
• Syringe Size: 10cc
• Weight: 35g (total product weight)

This solder paste is an excellent choice for professionals seeking a no-clean, high-performance solution for surface mount assembly with precise dispensing capabilities.