QUALITEK Lead-Free Solder Paste, SnAgCu, 250g Pot

The QUALITEK Lead-Free Solder Paste is a high-performance solder paste designed for surface-mount technology (SMT) applications. Formulated with a 95.5/3/0.5 Sn/Ag/Cu alloy, it provides excellent soldering performance while complying with lead-free regulations. This paste ensures a broad process window for ease of use, whether for manual or automated assembly.

The no-clean flux formulation leaves behind transparent, non-corrosive, and non-conductive residues, eliminating the need for post-soldering cleaning. Housed in a convenient 250g pot, this solder paste is ideal for SMT printing and is compatible with Type 3 MESH.

With a melting temperature range of 217°C-219°C, it delivers reliable bonding for electronic components. Perfect for professional and hobbyist applications, this solder paste combines quality, efficiency, and environmental compliance.

Key Features:

• Lead-free composition (95.5% Sn, 3% Ag, 0.5% Cu)
• No-clean flux – residue-free soldering
• Broad soldering process window
• Type 3 MESH compatibility
• Transparent, non-corrosive post-soldering residues
• Melting temperature: 217°C-219°C
• Packaged in a 250g pot