
T GLOBAL 2mm thermal conductive pad sheet with adhesive. Ideal for heat dissipation on CPUs, LEDs, motherboards & electronics.
The T GLOBAL L375 Thermal Conductive Pad is a versatile 2mm thick sheet designed for high-performance heat dissipation in modern electronic assemblies. This grey-coloured pad features a thermally conductive adhesive on one or both sides, significantly simplifying the manufacturing process by eliminating the need for separate thermal paste or mechanical fasteners.
Engineered with excellent thermal conductivity, it efficiently transfers heat away from critical components. The pad boasts a low thermal impedance and good compressibility, allowing it to conform to surface imperfections for optimal thermal contact. With a hardness rating of 25, it provides a durable yet pliable interface.
Primary Applications
This thermal pad is ideal for creating a reliable thermal connection between integrated circuits (ICs), central processing units (CPUs), and metal-oxide-semiconductor (MOS) components and their heatsinks or enclosure walls. It is expertly used to dissipate unwanted heat from a wide range of devices, including:
By providing a consistent thermal pathway, the T GLOBAL L375 pad helps maintain lower operating temperatures, enhancing the performance, reliability, and longevity of sensitive electronic equipment.
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