
Double-sided thermal adhesive sheet (0.95 W/m·K) for bonding gap fillers. Highly compressible, 150mm x 150mm size. Ideal for electronics cooling.
The T GLOBAL Thermal Adhesive Tape is a specialist double-sided adhesive sheet engineered specifically for bonding thermal gap fillers. It ensures a secure and thermally efficient interface between heat-generating components and their heatsinks, promoting optimal thermal management in a wide range of electronic applications.
This adhesive sheet boasts very good thermal conductivity, measured at 0.95 W/m·K, which facilitates the effective transfer of heat away from sensitive components. Its highly compressible nature allows it to conform to surface irregularities, ensuring complete contact and eliminating air gaps that can impede thermal performance. The good adhesion properties provide a reliable, long-lasting bond that withstands thermal cycling and mechanical stress.
Product Features
The tape is constructed from a composite of acrylic and fibreglass, providing a balance of adhesive strength and structural integrity. It has a thermal impedance of 1.8°C/W and comes in a convenient, pre-cut sheet size of 150mm x 150mm, making it ready for immediate use in various assembly scenarios.
Applications
This product is an essential component in electronics manufacturing and repair, used to securely attach thermal pads, gap fillers, and other thermal interface materials to CPUs, GPUs, power transistors, LED arrays, and other devices requiring controlled heat dissipation.
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