T GLOBAL Thermal Gap Filler, 1.5mm Sheet, Carbon, 1.7W/m.K

The T GLOBAL Thermal Gap Filler is a 1.5mm thick sheet made from a soft, highly compressible material, designed for straightforward assembly and excellent electrical insulation properties. This versatile material serves as an effective shock and vibration absorber, protecting sensitive electronic components from physical stress and enhancing overall system durability.

It is specifically engineered for applications involving integrated circuits (IC), central processing units (CPU), and metal-oxide-semiconductors (MOS), where it fills the connection gap between boards and enclosure walls to facilitate efficient heat conduction. This helps to manage thermal loads and prevent overheating in critical systems.

Primary Applications

This gap filler is ideal for dissipating heat from a wide range of electronic devices and components, including:

• Light-emitting diodes (LEDs)
• Motherboards
• Power supply units (PSUs)
• Televisions (TVs)
• Personal computers (PCs)
• Network hubs
• Handsets
• Memory hard drives

The material's low Shore hardness of 15 ensures it conforms easily to uneven surfaces, creating an optimal thermal interface. With a thermal conductivity of 1.7W/m.K, it efficiently transfers heat away from components, aiding in thermal management. Constructed from a carbon-based insulator body, it provides reliable electrical isolation where required.

Supplied as part of the L373 product range, this gap filler sheet is a essential component for engineers and technicians building or repairing electronic assemblies that require both thermal management and physical protection.