T GLOBAL Thermal Gap Filler Pad, 15mm x 33mm x 43mm

The T GLOBAL Thermal Gap Filler Pad is a soft, highly compressible material designed for easy assembly and reliable performance in electronic thermal management. Its primary function is to provide good electrical insulation while acting as a shock and vibration absorber, making it a versatile component for various electronic assemblies.

This gap filler is specifically used to aid heat conduction between boards and enclosure walls, and is effective for dissipating heat from components such as LEDs, motherboards, PSUs, TVs, PCs, hubs, handsets, and memory hard drives. It is suitable for use on ICs, CPUs, and MOS devices, ensuring efficient thermal transfer in critical applications.

Key Features & Benefits

• Highly Compressible: Soft material ensures easy assembly and conforms to uneven surfaces.
• Electrical Insulation: Provides good electrical insulation between components.
• Shock & Vibration Absorption: Helps protect sensitive electronic components from mechanical stress.
• Thermal Conductivity: 1.7 W/m.K for efficient heat dissipation.
• Shore Hardness: 15, indicating a very soft and flexible pad.

Applications

Designed for use in a wide range of electronic devices to improve thermal management and reliability. Ideal for filling gaps between heat-generating components and heat sinks or enclosure walls.

Constructed with a carbon insulator body material, this gap filler pad from the L373 product range is RoHS compliant and contains no SVHC substances as of January 2025, ensuring environmental compliance and safety.

Specifications

• Thermal Conductivity: 1.7 W/m.K
• Shore Hardness: 15
• Insulator Body Material: Carbon
• Product Range: L373
• Dimensions: 15mm x 33mm x 43mm