CHIP QUIK Lead Insertion Grade ESD Foam - Black 25mm

CHIP QUICK Lead Insertion Grade ESD Foam is an essential material for electronics assembly, repair, and handling. Specifically engineered to provide robust electrostatic discharge (ESD) protection, this rigid, conductive foam is the ideal solution for safeguarding delicate integrated circuits (ICs), microchips, and other sensitive components. Its primary function is to act as a secure insertion and storage medium for IC legs and pins, preventing damage from static electricity which can cause immediate or latent failure in electronic devices.

Constructed from a closed-cell foam, this material offers superior durability and rigidity compared to standard open-cell foams. This ensures it maintains its shape and protective qualities under repeated use, providing a reliable and long-lasting workspace solution. The foam features a precisely calibrated surface resistance of 1x10³ to 1x10⁵ ohms per square, offering optimal conductivity to safely dissipate static charges without being so conductive as to risk short-circuiting components. This makes it perfectly suited for use in ESD-protected workstations and during the transportation of sensitive parts.

Beyond its core use for IC insertion, this versatile foam is highly effective for blocking, bracing, cushioning, and wrapping sensitive electronics within packaging or during assembly processes. Its RoHS 3 and REACH compliance guarantees that it is manufactured without hazardous substances, aligning with modern environmental and safety standards for electronic manufacturing. For professionals and hobbyists alike, this ESD foam provides a dependable, high-performance barrier against electrostatic damage, ensuring the integrity and longevity of valuable electronic components.

Variant Details

• Size: 25mm