CHIP QUIK No-Clean Lead-Free Solder Wire, 0.8mm, 28g
High-quality lead-free solder wire (0.8mm, 28g) with no-clean flux—ideal for PCBs and precision soldering.
The CHIP QUIK No-Clean, Lead-Free Solder Wire is a premium-quality soldering solution designed for precision electronics work. With a 0.8mm diameter and 28g weight, it offers excellent handling for detailed soldering tasks where accuracy is essential.
Featuring a synthetic flux core with 1.2% flux concentration, this solder wire ensures smooth joins and clean, residue-free results. The no-clean, water-washable formula leaves a clear, non-corrosive, and non-conductive residue that can be safely left on the board, but any remaining residue is easily removable with water. This solder is halogen-free, making it an environmentally friendly choice for both professional and hobbyist applications.
The lead-free alloy composition (96.5% Sn, 3% Ag, 0.5% Cu) ensures safety while maintaining high melting performance, with a melting temperature of 220°C – ideal for circuit boards and delicate electronic components.
Applications
- PCB assembly and repair
- Surface mount technology (SMT)
- Consumer electronics manufacturing
- DIY electronics projects
- Dispatched within 0-2 business days
- Delivery to United States: 3-5 business days*
- Free Shipping Included
- PCB assembly and repair
- Surface mount technology (SMT)
- Consumer electronics manufacturing
- DIY electronics projects
- Material: Lead-free solder alloy (96.5% Sn, 3% Ag, 0.5% Cu)
- Diameter: 0.8mm
- Flux Core: 1.2% synthetic flux
- Flux Type: No-clean, water-washable
- Residue: Clear, non-corrosive, non-conductive
- Halogen-Free: Yes
- Melting Temperature: 220°C
- Weight: 28g (approx. 40g with packaging)
Always follow local regulations and product guidance.
Free standard delivery on Australian mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For faulty items, contact us within 14 days for a replacement or refund.
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