Chip Quik No Clean Solder Paste Sn96.5/Ag3.0/Cu0.5, 2-Part Mix, 15g (T4)
- SKU
- C3-SD02052
- EAN
- 3341854152222
- Brand
- Chip Quik
Lead-free no-clean solder paste (Sn96.5/Ag3.0/Cu0.5) ideal for SMT, BGA & fine-pitch soldering.
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- Dispatched within 0-2 business days
- Delivery to United States: 3-5 business days*
- Free Shipping Included
- Surface-mount technology (SMT)
- Fine-pitch component soldering
- Repair and rework of PCBs
- BGA and QFN soldering
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- Flux Type: No-Clean
- Flux Classification: REL0
- Metal Content: 87% by weight
- Particle Size: T4 (20-38 microns)
- Solder Alloy: Sn96.5/Ag3.0/Cu0.5
- Melting Temperature: 217°C
- Weight: 15g
- Packaging: 2-Part Mix
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