CHIP QUIK Sn96.5/Ag3.0/Cu0.5 No-Clean Solder Paste, 60g T4
Sn96.5/Ag3/Cu0.5 lead-free no-clean solder paste (60g, T4) - ideal for PCB assembly with minimal residue.
CHIP QUIK Solder Paste offers a high-quality, no-clean solution for lead-free soldering applications. This professional-grade solder paste is engineered with a Sn96.5/Ag3.0/Cu0.5 alloy composition, providing excellent solderability and thermal performance. With a melting temperature of 217°C, it is perfect for PCB assembly and delicate electronic component soldering.
The synthetic no-clean FLUX TYPE: REL0 ensures minimal residue post-soldering, eliminating the need for additional cleaning steps. The 87% metal content by weight ensures high conductivity and reliable joint formation. The finely tuned T4 particle size (20-38 microns) allows for precise application, ideal for fine-pitch components and intricate soldering work.
Efficient and easy to use, this solder paste features a two-part mix for consistent performance. Whether you're working on prototypes, PCB repairs, or production assemblies, this solder paste delivers reliable results every time.
Key Specifications
- Flux Type: Synthetic No-Clean (REL0)
- Metal Content: 87% by weight
- Alloy Composition: Sn96.5/Ag3.0/Cu0.5
- Particle Size: T4 (20-38 microns)
- Melting Temperature: 217°C
- Weight: 60g
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- Delivery to United States: 3-5 business days*
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- PCB assembly
- Surface mount technology (SMT)
- Fine-pitch component soldering
- Electronics repair and rework
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- Flux Type: No Clean
- Flux Classification: REL0
- Metal Content: 87% Metal by weight
- Particle Size: T4 (20-38 microns)
- Solder Alloy: 96.5% Sn, 3% Ag, 0.5% Cu
- Melting Temperature: 217°C
- Weight: 60g
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