Multicomp Lead-Free Solder Wire, 0.9mm, 250g, Sn99.3/Cu0.7

The Multicomp Lead-Free Solder Wire provides high-quality performance for general-purpose electronic assembly and rework applications. With a composition of 99.3% tin and 0.7% copper, it complies with all lead-free legislative requirements.

This solder wire contains multiple cores of rosin-based, halide-activated flux, ensuring fast and reliable soldering on copper, brass, and solder-coated surfaces. Its no-clean, pale-coloured residue eliminates the need for post-soldering cleaning, making it ideal for wave and reflow soldering processes, as well as repair operations.

Key Features:

• Contains rosin-based flux for enhanced wetting
• No-clean residue minimises post-soldering work
• Fast wetting for efficient soldering
• Halide-activated for better performance on nickel surfaces (depending on oxidation)
• Complies with lead-free regulations

Technical specifications:

• Alloy Composition: Sn99.3/Cu0.7 (99.3% Tin, 0.7% Copper)
• Flux Type: No Clean / Rosin Flux, halide-activated
• Diameter: 0.9mm
• Melting Temperature: 227°C
• Weight: 250g