MULTICOMP Lead-Free Solder Wire, 1mm, 217°C, 500g

The MULTICOMP Lead-Free Solder Wire is designed for users requiring a halide-free formulation (Type 400) while delivering high activity rosin flux. It offers superior soldering performance across a variety of materials including copper, brass, and nickel.

This solder wire features clear residues, low spitting, and fast soldering with minimal odour. The lead-free alloy is composed of 97.1% tin, 2.6% silver, and 0.3% copper, ensuring high-quality joints and compliance with national and international standards.

Key Benefits:

• Halide-free (Type 400) for reduced risk of corrosion
• High activity rosin flux for improved wetting and spreading
• Lead-free formulation, compliant with environmental standards
• Fast soldering with minimal residue
• Low spitting for clean application

Applications:

• PCB assembly
• Electrical repairs and prototyping
• Small-scale electronic projects