Multicore / Loctite No-Clean Desoldering Braid, 0.89mm x 30m
Efficient, no-clean desoldering braid by Multicore/Loctite for PCB repair, 30m length with static-free spool.
The Multicore / Loctite No-Clean Desoldering Braid is a high-quality, flux-coated copper braid designed for efficient and static-free desoldering of PC boards without requiring subsequent cleaning. This desoldering wick features a special halide-free, vacuumised no-clean flux coating, ensuring optimal performance even after prolonged storage in humid conditions. The braid remains flexible and does not flake, making it a reliable tool for PCB repair and maintenance.
Key Features
- No-Clean Design: Removes solder efficiently without leaving harmful residues, meeting MIL-P-28809A cleanliness standards.
- Faster Solder Absorption: High capillary action ensures quick and thorough solder removal.
- Static Dissipative Spool: Wound on a static-free spool for safe handling.
- Durable & Reliable: Long shelf life with heat-stable properties and resistance to humidity.
- Environmentally Considerate: Negligible non-corrosive, non-hygroscopic residues.
Usage Instructions
- Place the desoldering wick over the solder to be removed.
- Apply a soldering iron tip directly onto the braid.
- Wait for the solder to melt and be absorbed via capillary action.
- Remove the braid and dispose of solder-contaminated sections safely.
With its 30m length and 0.89mm width, this braid is ideal for precision PCB work and electronics repairs.
- PCB Repair & Rework
- Electronics Prototyping
- Solder Removal Tasks
- Component Replacement
- Material: Flux-Coated Copper
- Width: 0.89mm
- Length: 30m
- Standards: MIL-P-28809A compliant
- Heat-Stable Coating
- Non-Corrosive Residues
- Excellent Shelf Life
- Static-Dissipative Spool
Free standard delivery on Australian mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For faulty items, contact us within 14 days for a replacement or refund.
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