118278 products
Displaying 17971-18000 of 118278 products
STMicroelectronics VNP10N07-E N-channel Power MOSFET, 70V, 10A, 0.1ohm, TO-220. Fully auto-protected with thermal shutdown.
Infineon N Channel Power MOSFET, 200V, 30A, 0.075 ohm in a TO-247AC package. Features low on-resistance & fast switching.
Infineon CoolMOS™ Power MOSFET, 650V, 20.7A, 0.16Ω. For efficient AC-DC power supplies, computers & consumer electronics.
High-power Infineon N-Channel MOSFET, 55V, 110A, low Rds(on). Ideal for automotive and power management applications.
ON Semiconductor FDD4685 P-Channel MOSFET: 40V, 32A, low RDS(on), surface mount DPAK for efficient power switching in AC/DC supplies.
Surface mount glass-passivated rectifier diode. 50V, 1A, 30A surge. Low forward voltage drop. Ideal for power supplies and inverters.
BROADCOM HDSP-523E red 7-segment LED display, common cathode, 14.2mm height. Ideal for imaging, video, and commercial use.
HIGGSTEC 12.1-inch 5-wire resistive touchscreen panel. Durable, precise, and multi-input capable. Ideal for metering and automation.
BROADCOM HFBR-1523Z fibre optic transmitter for extended distance (110m), high noise immunity & secure data links. 0-70°C operation.
BOYD extruded aluminium heatsink with 2.7°C/W thermal resistance. Suitable for TO-218, TO-220, and TO-247 packages. Ideal for HVAC applications.
High-reliability 6.8V Zener diode in SOT-23 package. 350mW, lead-free, AEC-Q101 qualified for automation & automotive use.
FTDI RPi-HUB-MODULE USB hub and multi-interface converter for Raspberry Pi, with three USB 2.0 ports and UART, SPI, I2C, JTAG and GPIO support.
40-way male to male jumper ribbon cable, 200mm long. Ideal for PCB connections and wire harnesses. Rainbow colour coding for easy organisation.
Low power 8/16-bit AVR XMEGA microcontroller, 128KB flash, 78 I/O, 32MHz, 100-TQFP. Ideal for industrial & embedded systems.
Discover electronic components with O'Reilly Volume 2. Covers signal processing, diodes, transistors & more. Ideal for hobbyists & engineers.
Expand your Arduino Uno with the MIKROELEKTRONIKA Click Shield. Features two mikroBUS sockets for 75+ click boards. Supports 3.3V & 5V.
NXP 74HC574 high-speed octal D flip-flop with tri-state outputs. 14ns delay, 123MHz, for communications & networking. SOIC-20 package.
SEEED STUDIO BeagleBone Green dev board with 2x Grove ports. ARM Cortex-A8, 512MB RAM, 4GB storage. Ideal for IoT and prototyping.
Amec Thermasol 10x10x2mm micro-porous ceramic heatsink with pre-applied thermally conductive silicone tape. Electrically insulating.
FTDI FT600 32-bit FIFO to USB 3.0 bridge evaluation board for prototyping USB 3.0 SuperSpeed interfaces with FPGA development boards.
Microchip TC7662A DIP-8 charge pump DC-DC converter IC with 40mA output, +3V to +18V input and -3V to -18V inverted output. No inductors required.
NXP absolute pressure sensor for altimeter & barometer applications. 6-pin SIP, 15-115kPa range, analogue output. Ideal for microcontrollers.
STM 3.3V LDO voltage regulator in SOT-223 package. 800mA output, low dropout, high PSRR. Ideal for stable power in electronics.
Harwin 32-way DIL IC socket with gold-plated beryllium copper contacts. Low-profile, auto-insertable design. Sold in a 12-pack.
CamdenBoss 240V AC green neon indicator with chrome bezel & polycarbonate body. Ideal for electrical panels & industrial control.
T GLOBAL 1.5mm carbon gap filler sheet for electronics. Provides 3.2W/m.K thermal conductivity, electrical insulation & shock absorption.
BERGQUIST Sil-Pad 400 thermally conductive sheet (300x300mm). Provides 0.9W/m.K thermal conductivity and 3.5kV electrical isolation.
Professional two-part epoxy adhesive. Thermally conductive (0.836 W/m·K) & electrically insulating. Replaces mechanical fastenings.
BOYD PF436G aluminium heatsink for TO-220 devices. 25°C/W thermal resistance, horizontal mount, black anodised finish.
BOYD aluminium heatsink for TO-220/218/247 packages. Thermal resistance 8.6°C/W, with solderable tabs. Ideal for power electronics cooling.
