118278 products
Displaying 18271-18300 of 118278 products
100-piece through hole transistor kit by Whadda UK. Includes BC547B, BC557B, BC337 & more. Ideal for prototyping and circuit repairs.
MIKROE-4 128x64 graphic LCD module with blue backlight & parallel interface. Ideal for embedded design and electronic development projects.
NXP 74HC259D 8-bit addressable latch in SOIC16 package. Features 74HC logic, 2 V to 6 V supply range and 25 mA output current.
Clear protective case for CodeBug board. Transparent PC lid & textured ABS base allow full access to connections. Ideal for education & projects.
Full-featured C compiler for PIC32 MCUs on USB key, with IDE, debugger, simulator, and 30% code optimization.
FTDI FT600 evaluation board bridging a 16-bit FIFO bus to USB 3.0 with FMC and HSMC connector options for FPGA prototyping.
Step-down monolithic power switching regulator IC by STMicroelectronics. Adjustable 1.2-35V output, 1A max current, SOIC-8 package.
Power Integrations TNY268PN off-line switcher IC in an 8-pin DIP package with 700V MOSFET, auto-restart protection and 132kHz switching frequency.
Precision 5V micropower shunt voltage reference by DIODES INC. SOT-23 package, 1% accuracy, ideal for battery-powered & portable equipment.
Harwin 40 way DIL IC socket, 0.6in/15.42mm, pack of 10. Four-leaf beryllium copper contacts with gold plating and glass-filled polyester body.
Professional 515 MPA series threaded neon indicator with polycarbonate lens & chrome bezel. For clear signalling in panels & enclosures.
Soft, compressible T GLOBAL gap filler sheet (0.5mm). Provides electrical insulation and dissipates heat from CPUs, LEDs, and motherboards.
High-performance Bergquist Sil-Pad 2000 sheet for thermal management. 150x150mm, 4kV isolation, 3.5W/m·K conductivity. Ideal for military/aerospace.
High-conformability BERGQUIST thermal pad. 2.7W/m·K conductivity, 100x100mm sheet for heat sinks & electronics.
BOYD PF752 aluminium clip-on heatsink for TO220 packages. 23°C/W thermal resistance, vertical mount. For industrial power management.
BOYD aluminium heatsink for TO220/218 packages. 10°C/W thermal resistance with solderable tabs. Ideal for power electronics cooling.
ABL HEATSINKS aluminium T-slots heat sink, 0.87°C/W thermal resistance. For HVAC and electronic thermal management.
Diodes ZTX450 NPN silicon transistor in E-Line TO-92 package, 45V Vce and 1A collector current, for through-hole PCB mounting.
Multicomp Pro TIP120 NPN Darlington transistor in TO-220 package, rated 60 V Vce, 5 A continuous collector current and 65 W power dissipation.
INFINEON IRF640NPBF 200V, 18A N-Channel MOSFET with 0.15 ohm Rds(on). Rugged, fast-switching for power supplies & motor control.
Infineon CoolMOS™ N Channel Power MOSFET, 650V, 31A, 0.09 ohm. TO-220 through hole package for power management and adaptors.
INFINEON N-Channel Power MOSFET, 40V, 162A, TO-220AB. Automotive qualified with fast switching. Ideal for power management.
Infineon IRFP4321PBF 78A, 150V N-Channel MOSFET in TO-247AC package. Low RDS(ON) for high-efficiency power management & industrial use.
ONSEMI S1G glass passivated diode. 400V, 1A, 1.8µs recovery. Low capacitance for power management & switching circuits.
Broadcom HDSP-521G 14.2mm green 7-segment LED display, 2-digit, common anode. Ideal for commercial & prototyping applications.
POWERTIP 20x2 alphanumeric LCD module, 5V parallel interface, black on yellow/green STN transflective display.
Broadcom Versatile Link fibre optic transmitter. 1Mbaud data rate, 660nm LED, TTL compatible. Ideal for networking & automotive.
Compact HERO laser module with 650nm wavelength, fixed focus, and 990µW output. Ideal for industrial alignment and measurement.
FTDI FT232R USB to UART TTL evaluation kit with 300 baud to 3 Mbps transfer rates, 5V or 3V TTL levels and integrated 1024-bit EEPROM.
NXP Hex Inverting Schmitt Trigger Buffer (SOIC-14) for enhanced noise immunity. Ideal for clock timing & embedded designs.
