CHIP QUIK No-Clean Lead-Free Solder Paste, Sn96.5/Ag3/Cu0.5, 50g Jar
High-quality no-clean lead-free solder paste (Sn96.5/Ag3/Cu0.5) in 50g jar. Ideal for PCB assembly and precision soldering.
The CHIP QUIK No-Clean Lead-Free Solder Paste is a high-performance solder paste designed for efficient and reliable electronics assembly. This solder paste is supplied in a convenient 50g jar and is ideal for various soldering applications where cleanliness and ease of use are paramount.
With no-clean properties, this solder paste eliminates the need for post-soldering cleaning, reducing both time and cost. It features excellent wetting compatibility with most board finishes, ensuring strong and reliable solder joints. The low voiding characteristic enhances electrical conductivity and mechanical strength.
Key Features:
- Printing speeds up to 100mm/sec for high-efficiency assembly
- Long stencil life reduces the need for frequent replacements
- Wide process window for versatile applications
- Clear residue that does not require cleaning
- Dispense grade for easy application
- Compatible with enclosed print heads for precision work
Performance and Compatibility:
- Passes BONO test @ 1.56% for reliability
- Shelf life: >6 months when refrigerated, >2 months at room temperature
- Flux Type: Synthetic No Clean
- Solder Alloy Composition: 96.5% Sn, 3% Ag, 0.5% Cu
- Melting Temperature: 220°C
Whether you're working on professional PCB assembly or DIY electronics projects, this solder paste delivers consistent performance and superior results.
Need larger quantities? Need additional quantities? Get in touch and we'll arrange it for you.
- Shipped within 0-2 business days
- Shipping to United States: 3-5 business days*
- Free Shipping Included
- PCB assembly
- Surface-mount technology (SMT)
- Electronics prototyping
- DIY electronics projects
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- No-clean lead-free formulation
- Printing speed: Up to 100mm/sec
- Long stencil life
- Wide process window
- Clear residue for no post-soldering cleaning
- Low voiding for reliable connections
- Excellent wetting compatibility with most board finishes
- Dispense grade for easy application
- Compatible with enclosed print heads
- Passes BONO test @ 1.56%
- Shelf Life: >6 months (refrigerated), >2 months (unrefrigerated)
- Flux Type: Synthetic No Clean
- Solder Alloy: Sn96.5/Ag3/Cu0.5
- Melting Temperature: 220°C
- Net Weight: 50g
- Gross Weight: 70g
Always follow local regulations and product guidance.
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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