CHIP QUIK No-Clean Lead-Free Solder Paste, Sn96.5/Ag3/Cu0.5, 250g
Premium no-clean lead-free solder paste (Sn96.5/Ag3/Cu0.5) for PCB assembly. 250g jar, T3 mesh, 220°C melting point.
The CHIP QUIK No-Clean Lead-Free Solder Paste is a high-performance solution designed for modern soldering applications. This 250g jar contains a premium-grade, no-clean solder paste with excellent wetting compatibility on most board finishes, ensuring reliable and efficient soldering results.
Specially formulated with a Sn96.5/Ag3/Cu0.5 alloy, this solder paste offers a low melting temperature of 220°C, making it suitable for delicate electronic components. The dispense-grade formulation is compatible with enclosed print heads, providing ease of application and reducing waste.
Features:
- No-clean synthetic flux leaves minimal residue
- Long stencil life for extended usability
- Wide process window for versatile soldering conditions
- Printing speeds of up to 100mm/sec for efficiency
- Low voiding ensures strong, reliable solder joints
- Passes BONO test at 1.56% for quality assurance
Storage & Shelf Life:
- Refrigerated: >6 months
- Unrefrigerated: >2 months
Whether for professional PCB assembly or hobbyist projects, this CHIP QUIK solder paste delivers consistent performance and high reliability.
- PCB assembly
- SMT (Surface Mount Technology)
- Electronics prototyping
- Repair and rework
- Alloy Composition: 96.5% Sn, 3% Ag, 0.5% Cu
- Flux Type: Synthetic No Clean
- Melting Temperature: 220°C
- Weight: 250g
- Mesh Size: T3
- Printing Speed: Up to 100mm/sec
- Shelf Life (Refrigerated): >6 months
- Shelf Life (Unrefrigerated): >2 months
- Voiding: Low
- Compatibility: Works with most board finishes
Always follow local regulations and product guidance. Use appropriate PPE.
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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