CHIP QUIK No-Clean Lead-Free Solder Paste, Sn96.5/Ag3/Cu0.5, 250g
Premium no-clean lead-free solder paste (Sn96.5/Ag3/Cu0.5) for PCB assembly. 250g jar, T3 mesh, 220°C melting point.
The CHIP QUIK No-Clean Lead-Free Solder Paste is a high-performance solution designed for modern soldering applications. This 250g jar contains a premium-grade, no-clean solder paste with excellent wetting compatibility on most board finishes, ensuring reliable and efficient soldering results.
Specially formulated with a Sn96.5/Ag3/Cu0.5 alloy, this solder paste offers a low melting temperature of 220°C, making it suitable for delicate electronic components. The dispense-grade formulation is compatible with enclosed print heads, providing ease of application and reducing waste.
Features:
- No-clean synthetic flux leaves minimal residue
- Long stencil life for extended usability
- Wide process window for versatile soldering conditions
- Printing speeds of up to 100mm/sec for efficiency
- Low voiding ensures strong, reliable solder joints
- Passes BONO test at 1.56% for quality assurance
Storage & Shelf Life:
- Refrigerated: >6 months
- Unrefrigerated: >2 months
Whether for professional PCB assembly or hobbyist projects, this CHIP QUIK solder paste delivers consistent performance and high reliability.
- PCB assembly
- SMT (Surface Mount Technology)
- Electronics prototyping
- Repair and rework
- Alloy Composition: 96.5% Sn, 3% Ag, 0.5% Cu
- Flux Type: Synthetic No Clean
- Melting Temperature: 220°C
- Weight: 250g
- Mesh Size: T3
- Printing Speed: Up to 100mm/sec
- Shelf Life (Refrigerated): >6 months
- Shelf Life (Unrefrigerated): >2 months
- Voiding: Low
- Compatibility: Works with most board finishes
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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