Multicomp Lead-Free Solder Wire 0.7mm, 500g
High-quality Multicomp lead-free solder wire (0.7mm, 500g) for no-clean PCB assembly and repairs. Sn99.3/Cu0.7 alloy with thermal stability.
The Multicomp Lead-Free Solder Wire features a Type 505 solid flux core, specially formulated for no-clean wave and reflow soldering processes, eliminating the need for post-soldering cleaning. Its mildly activated no-clean flux formulation ensures low fuming and minimal spitting, while leaving clear residues that do not require removal.
This solder wire is compatible with lead-free assembly processes and is ideal for PCB rework and repair operations. Its high thermal stability makes it suitable for use with high-melting-temperature alloys, ensuring reliable performance across various applications.
Key Features:
- Fast soldering on copper, brass, and solder-coated surfaces
- Good activity on nickel (depending on oxidation state)
- Complies with all lead-free regulations
- Low activation flux reduces residue concerns
Technical Specifications:
- Material Composition: 99.3% Tin, 0.7% Copper
- Flux Type: No Clean / Rosin Flux (halide activated)
- Diameter: 0.7mm
- Melting Temperature: 227°C
- Weight: 500g
Perfect for electronics assembly, PCB repair, and general lead-free soldering tasks, this Multicomp solder wire ensures clean, efficient, and regulatory-compliant joints.
- No-clean wave soldering
- Reflow soldering processes
- PCB assembly and rework
- Electrical repairs
- Material Composition: 99.3% Tin, 0.7% Copper
- Flux Type: No Clean and Rosin Flux (halide activated)
- Diameter: 0.7mm
- Melting Temperature: 227°C
- Weight: 500g
- Flux Content: 3% by weight
- Formulation: No-clean, low activation
- Compliance: Lead-free legislative requirements
Free standard delivery on US mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For defective items, contact us within 14 days for a replacement or refund.
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