BERGQUIST Thermal Interface Gap Pad - 4.1mm
- SKU
- C3-SC10739
- EAN
- 3562074152247
BERGQUIST adhesive-backed thermal gap pad for heat sinks. Reduces thermal resistance, dampens vibration, and is automation-friendly.
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- Sheet Dimensions
- 100 mm x 100 mm
- Weight
- 70 grams
- Material
- Gap Pad
- Thermal Conductivity
- 0.8 W/m·K
- Thermal management of electronic components
- Bridging gaps between heat sinks and devices
- Applications with uneven surface topography
- Environments requiring vibration dampening
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- Material: Gap Pad
- Thermal Conductivity: 0.8 W/m·K
- Sheet Dimensions: 100 mm x 100 mm
- Weight: 70 grams
- Sheet Thickness: 4.1 mm
- Special Feature: Adhesive-backed for easy application
- Special Feature: Highly conformable to surface irregularities
- Special Feature: Low-stress vibration dampening
- Special Feature: Compatible with automated dispensing equipment
- SVHC: No SVHC (25-Jun-2025)
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