BOYD BGA Heat Sink with Thermal Pad - 27 x 27
- SKU
- C3-SC10769
- EAN
- 3562074152384
Space-saving BOYD aluminium BGA heat sink with peel-and-stick pad. Features pin-fin array for efficient cooling, no mounting holes needed.
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- Resistance
- 20.3°C/W
- Heat Sink Material
- Aluminium
- **Weight:** 69 grams
- **Height:** 43 mm
- **Cooling BGA packages** on printed circuit boards (PCBs)
- **Compact electronic devices** where board space is limited
- **Applications requiring tool-free, clean assembly**
- **Systems with varied or omni-directional airflow**
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- **Fin Dimensions (LxW):** 8 x 8 mm
- **Thermal Resistance:** 20.3 °C/W
- **Material:** Aluminium
- **Weight:** 69 grams
- **Height:** 43 mm
- **Width:** 33 mm
- **Depth:** 15 mm
- **Special Feature:** Tape mounting (peel-and-stick)
- **Special Feature:** Pin-fin array for omni-directional airflow
- **Packages Cooled:** BGA (Ball Grid Array)
- Resistance: 20.3°C/W
- Heat Sink Material: Aluminium
- SVHC: No SVHC (15-Jan-2018)
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