BOYD BGA 10 Heatsink with Pad - 27 x 27
- SKU
- C3-SC10763
- EAN
- 3562074152360
Efficient aluminium BGA heatsink with pad by BOYD. Features pin-fin array for omni-directional airflow & peel-and-stick tape mounting to save board space.
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- Thermal Resistance
- 30.6°C/W
- Fin Dimensions (LxW)
- 13 x 12 mm
- Weight
- 65 grams
- Overall Height
- 43 mm
- Cooling BGA packages on PCBs
- Applications requiring space-saving thermal management
- Electronics assemblies with constrained board layouts
- Devices where quick, clean assembly is preferred
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- Heat Sink Material: Aluminium
- Thermal Resistance: 30.6°C/W
- Packages Cooled: BGA
- Mounting Method: Tape (peel and stick)
- Fin Design: Pin-fin array for omni-directional airflow
- Fin Dimensions (LxW): 13 x 12 mm
- Weight: 65 grams
- Overall Height: 43 mm
- Overall Width: 33 mm
- Overall Depth: 15 mm
- Resistance: 30.6°C/W
- SVHC: No SVHC (15-Jan-2018)
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