CHIP QUIK Lead-Free Low-Temperature Solder Paste, 5cc Syringe
Low-temperature, lead-free solder paste (138°C) in 5cc syringe. No-clean flux, Sn42/Bi57.6/Ag0.4 alloy. Ideal for PCBs.
The CHIP QUIK Lead-Free Low-Temperature Solder Paste in a 5cc syringe applicator offers precise dispensing for delicate PCB (Printed Circuit Board) assembly and repair work. This no-clean, lead-free solder paste features a low melting point (138°C), reducing the risk of thermal damage to sensitive electronic components. Its formulation ensures excellent wetting compatibility on most board finishes, minimising voids for reliable solder joints.
Key Features
- Low melting point (138°C) for reduced thermal stress on components
- No-clean flux residue, simplifying post-soldering cleaning
- Long stencil life and wide process window for consistent application
- Optimised for high-speed printing (up to 100mm/sec)
- Compatible with enclosed printing systems for automated processes
Specifications
- Alloy Composition: Sn42/Bi57.6/Ag0.4 (Tin, Bismuth, Silver)
- Flux Type: No Clean
- Shelf Life: >6 months refrigerated or >2 months unrefrigerated
- Dispensing Method: Syringe with plunger and tip for controlled application
Ideal for rework, SMD assembly, and prototyping, this solder paste provides superior performance while maintaining component safety.
- PCB assembly
- Surface-mount device (SMD) soldering
- Delicate component rework
- Prototyping
- Lead-free formulation
- No-clean flux residue
- Low melting point: 138°C
- Alloy: Sn42/Bi57.6/Ag0.4
- Printing speed: Up to 100mm/sec
- Long stencil life
- Wide process window
- Low voiding
- Excellent wetting compatibility
- Dispense-grade consistency
- Shelf life: >6 months (refrigerated), >2 months (unrefrigerated)
Free standard delivery on UK mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For faulty items, contact us within 14 days for a replacement or refund.
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