CHIP QUIK No-Clean Solder Paste Sn42/Bi57.6/Ag0.4, 60g T4
Lead-free, no-clean solder paste with Sn42/Bi57.6/Ag0.4 alloy. Ideal for precision PCB assembly, 60g T4 particle size.
The CHIP QUIK No-Clean Solder Paste offers a high-performance, lead-free solution for your soldering needs. With a composition of Sn42/Bi57.6/Ag0.4, this solder paste is perfect for applications requiring precision and reliability. The synthetic no-clean flux ensures minimal residue, eliminating the need for post-soldering cleaning.
Featuring an 87% metal content by weight, this solder paste provides excellent conductivity and strong solder joints. The T4 particle size (20-38 microns) makes it ideal for fine-pitch applications, ensuring precise placement and minimal bridging.
This product comes as a two-part mix, offering convenience and extended shelf life. When stored unrefrigerated, it has a shelf life of 2 years before mixing and more than 6 months when refrigerated after mixing. For optimal performance, use within 2 months if stored unrefrigerated after mixing.
With a low melting temperature of 138°C, this solder paste is suitable for heat-sensitive components, reducing the risk of thermal damage. The no-clean flux classification (REL0) ensures compliance with industry standards while maintaining excellent soldering performance.
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- Precision soldering applications
- Fine-pitch PCB assembly
- Heat-sensitive component soldering
- Lead-free soldering requirements
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- Flux Type: Synthetic No-Clean
- Flux Classification: REL0
- Metal Content: 87% by weight
- Particle Size: T4 (20-38 microns)
- Two-part mix
- Shelf Life: 2 years unrefrigerated (before mixed), >6 months refrigerated/>2 months unrefrigerated (after mixing)
- Solder Alloy: Sn42/Bi57.6/Ag0.4
- Melting Temperature: 138°C
- Weight: 60g
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