CHIP QUIK Sn96.5/Ag3.0/Cu0.5 No-Clean Solder Paste, 60g T4

CHIP QUIK Solder Paste offers a high-quality, no-clean solution for lead-free soldering applications. This professional-grade solder paste is engineered with a Sn96.5/Ag3.0/Cu0.5 alloy composition, providing excellent solderability and thermal performance. With a melting temperature of 217°C, it is perfect for PCB assembly and delicate electronic component soldering.

The synthetic no-clean FLUX TYPE: REL0 ensures minimal residue post-soldering, eliminating the need for additional cleaning steps. The 87% metal content by weight ensures high conductivity and reliable joint formation. The finely tuned T4 particle size (20-38 microns) allows for precise application, ideal for fine-pitch components and intricate soldering work.

Efficient and easy to use, this solder paste features a two-part mix for consistent performance. Whether you're working on prototypes, PCB repairs, or production assemblies, this solder paste delivers reliable results every time.

Key Specifications

• Flux Type: Synthetic No-Clean (REL0)
• Metal Content: 87% by weight
• Alloy Composition: Sn96.5/Ag3.0/Cu0.5
• Particle Size: T4 (20-38 microns)
• Melting Temperature: 217°C
• Weight: 60g