T GLOBAL Thermal Gap Filler Sheet - 1.5mm

The T GLOBAL Thermal Gap Filler Sheet is a soft, highly compressible interface material designed for efficient thermal management and electrical insulation in advanced electronic applications. This easy-to-assemble sheet is engineered to fill microscopic air gaps between heat-generating components and heat sinks or enclosure walls, significantly improving the conduction of heat away from sensitive parts.

Its key function is as a shock and vibration absorber, protecting delicate ICs, CPUs, and MOSFETs from mechanical stress while ensuring continuous thermal contact. The material excels at dissipating heat from high-performance components such as LEDs, motherboards, power supply units (PSUs), televisions, personal computers, network hubs, mobile handsets, and memory hard drives, preventing overheating and enhancing system reliability and longevity.

Technical Properties & Features

• Material Composition: A specialised, soft silicone-based compound offering high compressibility.
• Primary Function: Acts as a thermal interface material (TIM) and electrical insulator.
• Thermal Conductivity: Provides efficient heat transfer with a rating of 2.2W/m.K.
• Dielectric Strength: Offers excellent electrical insulation with a dielectric strength of 5kV/mm.
• Shore Hardness: Features a very soft durometer of Shore 10 for maximum conformability.
• Application Method: Simple to cut, shape, and apply, facilitating quick and reliable assembly in production or repair environments.

This gap filler sheet is an essential component for engineers seeking to optimise thermal performance, ensure electrical safety, and protect electronics from environmental stresses in a compact and effective form factor.

Variant Details

• Size: 1.5mm