Displaying 10111-10140 of 116084 products
Mikroelektronika
MIKROE-4 128x64 graphic LCD module with blue backlight & parallel interface. Ideal for embedded design and electronic development projects.
NXP
NXP 74HC259D 8-bit addressable latch in SOIC16 package. Features 4 operating modes, serial-parallel conversion & 2-6V supply.
Codebug
Clear protective case for CodeBug board. Transparent PC lid & textured ABS base allow full access to connections. Ideal for education & projects.
Full-featured C compiler for PIC32 MCUs on USB key, with IDE, debugger, simulator, and 30% code optimization.
FTDI
FTDI evaluation board for FT600 USB 3.0 bridge IC. Features 16-bit FIFO, HSMC/FMC connector & multi-voltage I/O for FPGA development.
St MicroElectronics
Step-down monolithic power switching regulator IC by STMicroelectronics. Adjustable 1.2-35V output, 1A max current, SOIC-8 package.
Power Integrations
EcoSmart TNY268PN off-line switcher IC, 8-pin DIP. 700V MOSFET, 132kHz, for efficient, low-noise power supplies up to 23W.
Diodes Inc.
Precision 5V micropower shunt voltage reference by DIODES INC. SOT-23 package, 1% accuracy, ideal for battery-powered & portable equipment.
Harwin
Harwin 40-way DIL socket with gold-plated beryllium copper contacts. Low-profile, auto-insertable design. Pack of 10.
CamdenBoss
Professional 515 MPA series threaded neon indicator with polycarbonate lens & chrome bezel. For clear signalling in panels & enclosures.
T Global
Soft, compressible T GLOBAL gap filler sheet (0.5mm). Provides electrical insulation and dissipates heat from CPUs, LEDs, and motherboards.
Bergquist
High-performance Bergquist Sil-Pad 2000 sheet for thermal management. 150x150mm, 4kV isolation, 3.5W/m·K conductivity. Ideal for military/aerospace.
High-conformability BERGQUIST thermal pad. 2.7W/m·K conductivity, 100x100mm sheet for heat sinks & electronics.
Boyd
BOYD PF752 aluminium clip-on heatsink for TO220 packages. 23°C/W thermal resistance, vertical mount. For industrial power management.
BOYD aluminium heatsink for TO220/218 packages. 10°C/W thermal resistance with solderable tabs. Ideal for power electronics cooling.
ABL Heatsinks
ABL HEATSINKS aluminium T-slots heat sink, 0.87°C/W thermal resistance. For HVAC and electronic thermal management.
DIODES INC. ZTX450 NPN transistor, 45V 1A, in TO-92 E-Line package. Ideal for amplification and switching. Through-hole mount.
Multicomp Pro
Multicomp Pro TIP120 NPN Darlington transistor. TO-220 package, 5A, 60V, for switching & amplification in power & control circuits.
Infineon
INFINEON IRF640NPBF 200V, 18A N-Channel MOSFET with 0.15 ohm Rds(on). Rugged, fast-switching for power supplies & motor control.
Infineon CoolMOS™ N Channel Power MOSFET, 650V, 31A, 0.09 ohm. TO-220 through hole package for power management and adaptors.
INFINEON N-Channel Power MOSFET, 40V, 162A, TO-220AB. Automotive qualified with fast switching. Ideal for power management.
Infineon IRFP4321PBF 78A, 150V N-Channel MOSFET in TO-247AC package. Low RDS(ON) for high-efficiency power management & industrial use.
Onsemi
ONSEMI S1G glass passivated diode. 400V, 1A, 1.8µs recovery. Low capacitance for power management & switching circuits.
Broadcom
Broadcom HDSP-521G 14.2mm green 7-segment LED display, 2-digit, common anode. Ideal for commercial & prototyping applications.
Powertip
POWERTIP 20x2 alphanumeric LCD module, 5V parallel interface, black on yellow/green STN transflective display.
Broadcom Versatile Link fibre optic transmitter. 1Mbaud data rate, 660nm LED, TTL compatible. Ideal for networking & automotive.
Hero
Compact HERO laser module with 650nm wavelength, fixed focus, and 990µW output. Ideal for industrial alignment and measurement.
FTDI evaluation kit for FT232R USB-UART TTL. Up to 3Mbps, 5V/3V levels, EEPROM, no firmware needed.
NXP Hex Inverting Schmitt Trigger Buffer (SOIC-14) for enhanced noise immunity. Ideal for clock timing & embedded designs.
Pro Signal
40-way male to female jumper ribbon cable, 200mm, rainbow colours. Ideal for development boards and wire harnesses.